High Thermal Conductivity Ceramic PCB (Alumina Substrate)
High-Precision Gold-Traced Ceramic Circuit Board for Power & RF Applications
Product Overview
This high-performance ceramic PCB is manufactured on a high-purity alumina (Al₂O₃) substrate with precision gold plating. Designed for high-power LEDs, power modules, RF components, and high-temperature applications, it delivers exceptional thermal conductivity, electrical insulation, and reliability.
Key Features
- High thermal conductivity alumina substrate (≥24 W/m·K)
- Precision gold-plated traces for low contact resistance
- High dielectric strength and excellent electrical insulation
- Superior high-temperature and corrosion resistance
- Fine-pitch trace design for high-density packaging
- Customizable size, shape, and trace layout available
Technical Specifications
- Substrate Material: 96% / 99.6% Alumina (Al₂O₃)
- Surface Finish: Gold Plating (Ni/Au)
- Thermal Conductivity: 24 ~ 30 W/m·K
- Dielectric Strength: ≥ 10 kV/mm
- Operating Temperature: -55°C ~ 350°C
- Trace Pitch: Minimum 0.1mm (customizable)
Product Micro Detail
Typical Applications
This ceramic PCB is ideal for high-power LED modules, power semiconductors, automotive electronics, RF microwave components, sensors, and other applications requiring excellent heat dissipation and electrical stability.