What We Can Build
Manufacturing Capabilities
State-of-the-art equipment and rigorous quality control — delivering boards from simple 1-layer designs to complex 20-layer HDI boards.
Single-sided to complex multilayer, including HDI & flex.
Smallest board size we produce without compromising quality.
No minimum order quantity — prototype to mass production.
Rush 24-hour turnaround for prototype orders.
Minimum trace width / spacing 3 mil for HDI designs.
Certified quality management system across all production lines.
Technical Specifications
PCB Fabrication Parameters
All specifications below apply to our standard FR-4 process. Contact us for flexible, Rogers, or metal-core board specs.
Board Structure
| Parameter | Standard | Advanced |
|---|---|---|
| Layer Count | 1–8 layers | 10–20 layers |
| Board Thickness | 0.8 / 1.0 / 1.2 / 1.6 mm | 0.4 – 6.0 mm |
| Max Board Size | 450 × 600 mm | 500 × 700 mm |
| Min Board Size | 10 × 10 mm | 6 × 6 mm |
| Board Tolerance | ±0.15 mm | ±0.10 mm |
Copper & Traces
| Parameter | Standard | Advanced |
|---|---|---|
| Min Trace Width | 6 mil (0.15 mm) | 3 mil (0.075 mm) |
| Min Trace Spacing | 6 mil (0.15 mm) | 3 mil (0.075 mm) |
| Outer Copper Weight | 1 oz (35 µm) | 0.5 – 4 oz |
| Inner Copper Weight | 1 oz (35 µm) | 0.5 – 2 oz |
| Impedance Control | ±10% | ±5% |
Holes & Vias
| Parameter | Standard | Advanced |
|---|---|---|
| Min Drill Size | 0.3 mm | 0.1 mm (laser) |
| Min Via Pad | 0.6 mm | 0.4 mm |
| Aspect Ratio | 8:1 | 12:1 |
| Blind / Buried Vias | — | Available |
| Via-in-Pad | — | Available (filled) |
Surface Finish & Solder Mask
| Option | Details |
|---|---|
| HASL (Lead-free) | Most common, cost-effective |
| ENIG | Flat surface, RoHS compliant, excellent solderability |
| OSP | Organic coating, eco-friendly |
| Immersion Silver | High frequency applications |
| Immersion Tin | Good for press-fit connectors |
| Solder Mask Colors | Green / Black / Blue / Red / White / Yellow / Matte |
| Silkscreen Colors | White / Black / Yellow |
Material Options
Board Materials We Support
FR-4
Most PopularStandard glass-reinforced epoxy laminate. Excellent mechanical strength, good thermal stability. Suitable for most electronic applications.
High Tg FR-4
RecommendedHigh glass transition temperature variant for demanding thermal environments such as automotive and industrial electronics.
Rogers / PTFE
RF / MicrowaveLow dielectric loss material for RF, microwave, and high-frequency applications. Rogers 4350B, 4003C, RO3003 and others available.
Aluminum Core
High PowerMetal-core PCB for LED lighting and high-power applications. Superior thermal dissipation compared to standard FR-4.
Flexible (FPC)
Flex / Rigid-FlexPolyimide-based flexible circuits for wearables, medical devices, and space-constrained designs. Rigid-flex also available.
Halogen-Free
Eco-FriendlyHalogen-free laminate meeting IEC 61249-2-21 standard. Suitable for products requiring strict environmental compliance.
Built-in Quality
Every Board Is Tested
Our multi-stage inspection process catches defects before they reach you — so every board you receive is ready to use.
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DRC — Design Rule Check
Your Gerber files are automatically verified for design rule violations before production starts.
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AOI — Automated Optical Inspection
High-resolution camera systems scan every board for missing traces, short circuits, and solder issues.
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E-Test — Electrical Testing
100% electrical testing (flying probe or fixture) to verify connectivity and isolation on every net.
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Impedance Testing
Controlled-impedance coupons tested on each panel to verify target values within ±5%.
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Final Visual Inspection
Trained inspectors perform final QC checks before packaging and shipping.
Get Started
Ready to Order?
Upload your Gerber files or describe your requirements — get a quote in under 2 hours.