PCB Manufacturing & Assembly Capabilities

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Rigid PCB
Flex PCB

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PCB Specifications

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Features	Capability	Description
Layer count	1-32 Layers	The number of copper layers in the PCB
Controlled Impedance	4/6/8/10/12/14/16/18/20/.../32 layers	User Guide to the EAZYPCB Impedance Calculator EAZYPCB Impedance Calculator
Material	FR-4	Grade A laminates from suppliers including Nan Ya, KB, Shengyi and etc.
	Aluminum-Core	1-layer Aluminum-core PCBs
	Copper-Core	1-layer copper-core PCBs with direct heatsink contacts (≥ 1 × 1 mm)
	RF PCB	1 oz copper, 2-layer RF PCBs with Rogers and PTFE cores
FR-4 Dielectric Constants	4.5 (2-Layer PCB)	7628 Prepreg 4.4 3313 Prepreg 4.1 2116 Prepreg 4.16
Maximum Dimensions	FR4 PCB: 670 × 600 mm Rogers / PTFE Teflon PCB: 590 × 438 mm Aluminum PCB: 602 × 506 mm Copper PCB: 480 × 286 mm	These limits apply to PCBs with thickness ≥ 0.8 mm. The thinner FR4 PCBs are 500 × 600 mm maximum. 2-layer FR4 PCBs can reach a maximum size of 1020 × 600 mm.
Minimum Dimensions	Regular: 3 × 3 mm. Castellated / Plated Edges: 10 × 10 mm.	These limits apply to PCBs with thickness ≥ 0.6 mm. Manual review required for thinner PCBs. Panelization is recommended for small-sized boards.
Dimension Tolerance	±0.1mm	±0.1mm(Precision) and ±0.2mm(Regular) for CNC routing, and ±0.4mm for V-scoring
Thickness	0.4 - 4.5 mm	Thickness for FR4 are: 0.4/0.6/0.8/1.0/1.2/1.6/2.0 mm (2.5 mm and above are for 12+ layer PCBs only)
Thickness Tolerance (Thickness≥1.0mm)	± 10%	e.g. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
Thickness Tolerance (Thickness<1.0mm)	± 0.1mm	e.g. For the 0.8mm board thickness, the finished board thickness ranges from 0.7mm(T-0.1) to 0.9mm(T+0.1).
Finished Outer Layer Copper	1 oz / 2 oz (35um / 70um)	Finished copper weight of outer layer is 1oz or 2oz.
Finished Inner Layer Copper	0.5 oz / 1 oz / 2 oz (17.5um / 35um / 70um)	Finished copper weight of inner layer is 0.5oz by default.
Soldermask	Green, Purple, Red, Yellow, Blue, White, and Black.	We use LPI (Liquid Photo Imageable) solder mask. This is the most common type of mask used today. Heat-cured ink soldermask is usually found on low-cost, single-sided PCBs.
Surface Finish	HASL (leaded /lead-free), ENIG, OSP (copper core boards only)	FR4 has all three finishes available, 6+ layers and RF boards only have ENIG. Aluminum core boards only have HASL. Copper core boards only have OSP.

Drilling

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Features	Capability	Description
Drill Diameter	1-layer: 0.3 – 6.3 mm 2-layer: 0.15 – 6.3 mm Multilayer: 0.15 – 6.3 mm	Holes with diameter ≥ 6.3 mm are CNC routed from a smaller drilled hole. Min. drill diameter for 2- or more-layer PCBs is 0.15 mm (more costly) Min. drill diameter for aluminum-core PCBs is 0.65 mm Min. drill diameter for copper-core PCBs is 1.0 mm
Hole size Tolerance (Plated)	Through-holes: +0.13 / -0.08 mm Press-fit holes: ±0.05 mm (multilayer EMI boards only – mention the specific holes in PCB Remark)	e.g. for the 0.6mm hole size, the finished hole size between 0.52mm to 0.73mm is acceptable.
Hole size Tolerance (Non-Plated)	±0.2mm	e.g. for the 1.00mm Non-Plated hole, the finished hole size between 0.80mm to 1.20mm is acceptable.
Average Hole Plating Thickness	18μm
Blind/Buried Vias	Not supported	Currently we don't support Blind/Buried Vias, only make through holes.
Min. Via hole size/diameter	0.15mm / 0.25mm	1-layer (NPTH only): 0.3 mm hole size / 0.5 mm via diameter 2-layer: 0.15mm hole size / 0.25mm via diameter Multilayer: 0.15 mm hole size / 0.25 mm via diameter ① Via diameter should be 0.1mm(0.15mm preferred) larger than Via hole size. ② Preferred Min. Via hole size: 0.2mm
Min. Non-plated holes	0.50mm	Please draw NPTHs in the mechanical layer or keep out layer.
Min. Plated Slots	0.5mm	The minimum plated slot width is 0.5mm, which is drawn with a pad.
Min. Non-Plated Slots	1.0mm	The minimum Non-Plated Slot Width is 1.0mm, please draw the slot outline in the mechanical layer(GM1 or GKO)
Via Hole-to-Hole Spacing	0.2mm
Pad Hole-to-Hole Spacing	0.45mm
Min. Castellated Holes	0.60mm	Castellated holes are metalized half-holes on PCB edges, commonly used on daughter boards to be soldered onto carrier PCBs. ① Hole diameter (Ø): ≥ 0.6 mm ② Hole to board edge (L): ≥ 1 mm ③ Hole to hole (D): ≥ 0.6 mm ④ Min. PCB size: 10 × 10 mm ⑤ Min. PCB thickness: 0.6 mm
Plated Edges	10 x 10mm	Plated edges are copper-plated and ENIG treated, HASL is not supported. ① Min. PCB size: 10 × 10 mm ② Min. PCB thickness: 0.6 mm ③ At least 3 breaks (more for larger PCBs) in the edge plating are required for support tab connections
Rectangular Holes / Slots	Not supported	Rectangular holes and slots without rounded corners are not supported.

Traces

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Features	Capability	Description
Min. track width and spacing (1 oz)	0.10 / 0.10 mm (4 / 4 mil)	1- and 2-layer: 0.10 / 0.10 mm (4 / 4 mil) Multilayer: 0.09 / 0.09 mm (3.5 / 3.5 mil), 3 mil is acceptable in BGA fan-outs.
Min. track width and spacing (2 oz)	0.16 / 0.16 mm (6.5 / 6.5 mil)	2-layer: 0.16 / 0.16 mm (6.5 / 6.5 mil) Multilayer: 0.16 / 0.20 mm (6.5 / 8 mil)
Track width tolerance	±20%	e.g. For a 0.1 mm track, the finished track width ranges from 0.08 and 0.12 mm.
PTH annular ring	≥0.20mm	2-layer: 1 oz: Recommended 0.25 mm or above; absolute minimum 0.18 mm 2 oz: 0.254 mm or above Multilayer: 1 oz: Recommended 0.20 mm or above; absolute minimum 0.15 mm 2 oz: 0.254 mm or above
NPTH pad annular ring	≥0.45mm	Recommended 0.45 mm or more. This is to allow a 0.2 mm ring of copper to be removed around the hole for the sealing film to attach. Pad sizes smaller than the recommended value can result in the annular ring being very thin or completely missing.
BGA	0.25mm	① BGA pad diameter ≥ 0.25 mm ② BGA pad to trace clearance ≥ 0.1 mm (min. 0.09 mm for multilayer boards) ③ Vias can be placed within BGA pads using filled and plated-over vias
Trace coils	0.15/0.15mm	Minimum trace width/clearance: 0.15/0.15mm, when traces are covered by solder mask (1oz) Minimum trace width/clearance: 0.25/0.25mm, when traces are NOT covered by solder mask (1oz). ENIG only(high risk of short circuit with HASL)
Hatched grid width and spacing	0.25 mm
Same-net track spacing	0.25mm
Inner layer via hole to copper clearance	0.2mm
Inner layer PTH pad hole to copper clearance	0.3mm
Pad to track clearance	0.1mm	Min. 0.1 mm (stay well above if possible). Min. 0.09 mm locally for BGA pads
SMD pad to pad clearance (different nets)	0.15mm	More details of SMD pad spacing: SMD Components Minimum Spacing
Via hole to Track	0.2mm
PTH to Track	0.25mm	0.35mm is recommended, minimum 0.25mm
NPTH to Track	0.2mm

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Flexible PCB Capabilities

Category	Features	Capability	Description
Layer Count	1 layer,2 layers	The number of copper layers in the FPC	Rigid-flex PCBs are not yet supported.
FPC Stack-Up	Single-Sided	FPC with copper and coverlay on the same one side only. Inner PI thickness: 25 μm
FPC Stack-Up	Double-Sided	FPC with copper on both sides. Inner PI thickness: 25 μm
Dimensions	Maximum Dimensions	Regular: 234 × 490 mm	Absolute limit of 250 × 500 mm allowed with mandatory handling edges – confirm with customer support before ordering
	Minimum Dimensions	No limit, but FPCs whose dimension is smaller than 20 × 20 mm are best panelised	See Flex PCB panel design guidelines
	FPC Finished Thickness	Single-sided: 0.07 / 0.11 mm Double-sided: 0.11 / 0.12 / 0.2 mm	The thickness of the finished FPC excluding any stiffeners(If the measured area has no copper or coverlay, the finished thickness will be reduced.)
	Outer Layer Copper Weight	Single-sided: 18 μm (0.5 oz), 35 μm (1 oz) Double-sided: 12 μm (0.33 oz), 18 μm (0.5 oz), 35 μm (1 oz)	The thickness of copper on the FPC
	Type of Process	Dry film process with LDI (laser direct image) exposure technology	LDI provides higher accuracy than traditional LED exposure. The machines also support automatic alignment based on board size to eliminate pad offset issues.
	Surface Finish	ENIG. Thickness: 1u" / 2u"	ENIG deposits a nickel-gold coating on exposed pads to prevent oxidation.
	Thickness with Stiffener	Thickness with Stiffener = FPC Thickness + Stiffener Thickness	See the PI Stiffener Thickness Calculator
	FPC Thickness Tolerance	±0.05 mm	Additional tolerance exists for stiffeners. Thicker stiffeners have larger tolerances.
Holes	Hole Diameter	0.15-6.5 mm	The recommended maximum diameter for PTHs is 5 mm, if bigger may cause risks to production
	Diameter Tolerance	±0.08 mm	Example: A 1.00 mm designed diameter is allowed to yield any physical diameter between 0.92-1.08 mm.
	Minimum Plated Slot	0.50 mm
	Minimum Non-Plated Slot	Not limited	At least 0.2 mm copper clearance is required around non-plated slots.
	Castellated Holes	Castellated holes are plated half-holes on the edge of an FPC. Most often used for press-soldered connectors. ① Castellated hole diameter: ≥ 0.3 mm ② Castellated hole to board edge: ≥ 0.5 mm ③ Castellated hole to hole: ≥ 0.4 mm
	Min. Via hole size/diameter	0.15 mm (Via hole size)/ 0.35 mm (Via diameter) ① Annular ring: 0.1 mm minimum, 0.125 mm recommended ② Recommended via size: 0.3 mm inner, 0.55 mm outer
Traces	Annular Ring for PTH	≥ 0.25 mm recommended, absolute limit: 0.18 mm
	Minimum Trace Width/Spacing (1 oz)	① 12 μm (0.33 oz) copper: 3/3 mil (absolute limit 2/2 mil – avoid if possible) ② 18 μm (0.5 oz) copper: 3.5/3.5 mil ③ 35 μm (1 oz) copper: 4/4 mil These are regular capabilities. Contact customer support for custom capability requirements.
	Trace Width Tolerance	±20%	Example: A 0.10 mm designed trace width is allowed to yield any physical width between 0.08-0.12 mm.
	Pad-to-Trace Clearance	① Via ring to trace: ≥ 0.1 mm (more whenever possible) ② Exposed pad to trace：≥ 0.15 mm (more whenever possible)
	NPTH to Copper Clearance	≥ 0.20 mm	The clearance from an NPTH to traces, pads, and copper pours
	BGA	① BGA pad diameter: ≥ 0.25 mm ② BGA pad to trace clearance: ≥ 0.2 mm
Coverlay/ Soldermask	Coverlay Color	Yellow / Black / White	Yellow is recommended
	Coverlay Opening	Coverlay expansion (one-sided): 0.1 mm Coverlay opening to trace clearance: ≥ 0.15 mm (more whenever possible)
	Via covering	Recommended to keep coverlay over vias
	Coverlay Thickness	① PI: 12.5 μm, glue: 15 μm (on 12/18 μm copper） ② PI: 25 μm, glue: 25 μm (on 35 μm copper）
	Minimum solder bridge width	0.5 mm minimum, i.e. solder bridge narrower than 0.5 mm will be removed. Contact customer support for any non-standard requirements.
Silkscreen	Character Height	≥ 1mm (More in case of complex patterns or knock-out text)
	Character Line Width	≥ 0.15mm (Narrower lines do not print well)
	Character to Pad Clearance	≥ 0.15mm (Any silkscreen closer to a pad than this will be clipped)
FPC Outline	Laser Outline	① Copper to board edge ≥ 0.3mm ② Copper to slots ≥ 0.3mm ③ Outline tolerance: ±0.1 mm (±0.05 mm upon request)
	Gold Finger Pad to Board Edge Clearance	0.2 mm. Gold fingers will be cut back if exceeding this clearance to avoid damage during laser cutting the outline. Castellated pads are exempt from this clearance.
	Panels (See FPC Panel Design Guide)	① Spacing between boards is commonly 2 mm. For boards with metal stiffeners use 3 mm instead. ② Handling edges of width 5 mm required on all four sides. Copper pour is required on these edges, with 1 mm clearance around fiducials and 0.5 mm clearance around tooling holes. ③ Fiducials: 1 mm; tooling holes: 2 mm; Fiducial centre to board edge: 3.85 mm. Add four fiducials with one offset by 5 mm or more to aid orientation. ④ Support tab width: 0.7-1.0 mm ⑤ Maximum panel size: 234 × 490 mm
Stiffeners (Detailed Introduction)	PI Stiffener	Thickness options: 0.1 mm, 0.15 mm, 0.20 mm, 0.225 mm, 0.25 mm	PI stiffeners are most often used with gold finger connectors. For example if the connector needs to be 0.3 mm thick on a 0.11 mm FPC, a 0.225 mm stiffener thickness is most suitable.
	FR4 Stiffener	Thickness options: 0.1 mm, 0.2 mm	FR4 is usually only used on low-end products because it is prone to chipping. Avoid if possible.
	Stainless Steel Stiffener	Thickness options: 0.1 mm, 0.2 mm, 0.3 mm	Steel stiffeners cost more but have excellent flatness and do not easily deform. This makes them good as support under SMD components. Note that since steel is slightly magnetic it should not be used with hall effect sensors or similar components.
	3M Tape	3M9077 (0.05 mm thick; heat-resistant) 3M468 (0.13 mm thick; not heat-resistant)	Usually used to secure FPCs after assembly
	EM Shielding Film	18 μm thick, black. Helps lower EMC. The recommended practice is to add soldermask openings over edge guard rails to electrically connect them to the shield films.
Design Considerations	Impedance Calculation	Core polyimide εr: 3.3 Coverlay εr: 2.9 Core polyimide thickness: 25 μm	Impedance measurement and control are not yet supported. Traces are only controlled for width and the customer is responsible for choosing trace widths to achieve their impedance requirements.
	Other FPC Software	For compatibility on the layer types, include the outlines of the coverlay openings, stiffener outlines, and any other features in the design files. These should be included as separate layers in the Gerber output.
	Other Design Constraints	Same requirements as rigid PCBs in terms of holes, traces, clearances, and silkscreen.
	Gerber File Naming Convention	We recommend using standard Gerber file extensions as listed in the design guidelines. If you use non-standard file extensions we will still process your order but the risk of mistakes in layer stackup increases and processing time may be longer.

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